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Volgende maand is het weer zover de E3!!
de rumors zijn weer op gang ik vond dit over Nintendo zelf zeggen ze dat het niet waar is.
we zullen zien mischien niet dit jaar maar, de specs zien er goed uit.
Nintendo will announce new hardware called Nintendo Fusion during E3, according to reports, with specs for the machine posted online.
Published on May 2, 2014
Update: Nintendo has confirmed that no new hardware will be revealed at E3 2014.
Original story:
Nintendo is set to reveal new hardware during E3 2014, according to reports.
A number of sites, including IGN, Nintendo News and Videogamer say that they have heard from sources that Nintendo will announce their new hardware during E3 2014.
The news is something of a surprise given that the Nintendo 3DS and Wii U are not far into their life cycles, but perhaps Nintendo felt compelled to produce something new in response to poor Wii U sales.
It's not quite clear whether Nintendo's alleged now console is a handheld or home console, but Nintendo News have gone as far as to post specs and have claimed that the console is called Nintendo Fusion, suggesting that Nintendo's new console is some kind of handheld/home console hybrid.
The specs are as follows:
Nintendo Fusion DS
CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
2 130 mm DVGA (960 x 640) Capacitive Touchscreen
Slide Out Design with Custom Swivel Tilt Hinge
Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
Low End Vibration for Gameplay and App Alerts
2 Motorized Circle Pads for Haptic Feedback
Thumbprint Security Scanner with Pulse Sensing Feedback
2 1mp Stereoptic Cameras
Multi-Array Microphone
A, B, X, Y, D-Pad, L, R, 1, 2 Buttons 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
NFC Reader
3G Chip with GPS Location
Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
Nintendo 3DS Cart Slot
SDHC “Holographic Enhanced†Card Slot up to 128 Gigabyte Limit
Mini USB I/O
3300 mAh Li-Ion battery
Nintendo Fusion Terminal
GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
802.11 b/g/n Wireless
Bluetooth v4.0 BLE
2 USB 3.0
1 Coaxial Cable Input 1 CableCARD Slot
4 Custom Stream-Interface Nodes up to 4 Wii U GamePads Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot
1 HDMI 2.0 1080p/4K Port
Dolby TrueHD 5.1 or 7.1 Surround Sound
Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage
Nintendo won't have an official presence at E3, but will be holding a Nintendo Direct while the show is taking place. Expect any potential reveal then, but treat all this as rumour until that point.
nog even met een korreltje zout nemen,maar je weet het nooit
microsoft pers confrentie is 9 juni en daarna is het 2 dagen knallen
ben benieuwd.
de rumors zijn weer op gang ik vond dit over Nintendo zelf zeggen ze dat het niet waar is.
we zullen zien mischien niet dit jaar maar, de specs zien er goed uit.
Nintendo will announce new hardware called Nintendo Fusion during E3, according to reports, with specs for the machine posted online.
Published on May 2, 2014
Update: Nintendo has confirmed that no new hardware will be revealed at E3 2014.
Original story:
Nintendo is set to reveal new hardware during E3 2014, according to reports.
A number of sites, including IGN, Nintendo News and Videogamer say that they have heard from sources that Nintendo will announce their new hardware during E3 2014.
The news is something of a surprise given that the Nintendo 3DS and Wii U are not far into their life cycles, but perhaps Nintendo felt compelled to produce something new in response to poor Wii U sales.
It's not quite clear whether Nintendo's alleged now console is a handheld or home console, but Nintendo News have gone as far as to post specs and have claimed that the console is called Nintendo Fusion, suggesting that Nintendo's new console is some kind of handheld/home console hybrid.
The specs are as follows:
Nintendo Fusion DS
CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
2 130 mm DVGA (960 x 640) Capacitive Touchscreen
Slide Out Design with Custom Swivel Tilt Hinge
Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
Low End Vibration for Gameplay and App Alerts
2 Motorized Circle Pads for Haptic Feedback
Thumbprint Security Scanner with Pulse Sensing Feedback
2 1mp Stereoptic Cameras
Multi-Array Microphone
A, B, X, Y, D-Pad, L, R, 1, 2 Buttons 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
NFC Reader
3G Chip with GPS Location
Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
Nintendo 3DS Cart Slot
SDHC “Holographic Enhanced†Card Slot up to 128 Gigabyte Limit
Mini USB I/O
3300 mAh Li-Ion battery
Nintendo Fusion Terminal
GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
802.11 b/g/n Wireless
Bluetooth v4.0 BLE
2 USB 3.0
1 Coaxial Cable Input 1 CableCARD Slot
4 Custom Stream-Interface Nodes up to 4 Wii U GamePads Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot
1 HDMI 2.0 1080p/4K Port
Dolby TrueHD 5.1 or 7.1 Surround Sound
Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage
Nintendo won't have an official presence at E3, but will be holding a Nintendo Direct while the show is taking place. Expect any potential reveal then, but treat all this as rumour until that point.
nog even met een korreltje zout nemen,maar je weet het nooit
microsoft pers confrentie is 9 juni en daarna is het 2 dagen knallen
ben benieuwd.
